High-quality special sponge for removing fine scratches, holograms and polishing marks using Koch-Chemie Micro Cut and Micro Cut & Finish.
The short height of 25mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colourful non-woven material, suitable for polishing, ensures process safety. Optimisation of compression hardness and cell structure for soft and sensitive paints.
